Nvidia CEO Reveals Shift in Advanced Packaging Needs from TSMC
2025-01-16
Reuters
Nvidia's demand for advanced packaging from TSMC remains robust, however, the company's CEO Jensen Huang notes that its needs are evolving. This shift in requirements comes as the US AI chip giant continues to drive innovation in the field of artificial intelligence and machine learning. With a strong focus on semiconductor manufacturing, Nvidia is adapting its approach to advanced packaging to meet the changing landscape of AI technology and high-performance computing. Key technologies like 3D packaging and semiconductor manufacturing are playing a crucial role in this evolution. As a result, Nvidia's partnership with TSMC remains vital to its success.
